ANALYSIS OF INTRINSIC STRESS IN DIAMOND FILMS BY X-RAY DIFFRACTION, Q. Yang, L. Zhao and H. Xiao and N. Zhao, pp. 151-156
نویسندگان
چکیده
The relationships of the residual stress versus process parameters of diamond films grown by Hot Filament CVD were investigated by XRD. The intrinsic macrostress in the diamond films was tensile. The tensile stress decreased almost linearly with acetone concentration, and a minimum tensile stress was obtained at a deposition temperature of 9OOOC and 50 V bias voltage. The microstress in the film goes down with increasing deposition temperature and decreasing positive bias voltage. The relationships between stress and growth parameters were explained according to the microstructure of the diamond films. By optimizing the process parameters, the tensile intrinsic macrostress of diamond films can be reduced greatly without changing the quality of the films. The microstress in the films was released when the samples were heat-treated.
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